Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10662315 | Epoxy resin molding material for sealing and electronic component device | Mitsuyoshi Hamada, Fumio Furusawa, Keizo Takemiya, Toru Baba | 2020-05-26 |
| 7544727 | Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate | Masanobu Fujii, Shinsuke Hagiwara | 2009-06-09 |
| 7397139 | Epoxy resin molding material for sealing use and semiconductor device | Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou, Takaki Kashihara +4 more | 2008-07-08 |
| 5066691 | Adhesive composition for metal-clad laminates | Toshihisa Kumakura, Ken Nanaumi, Hideki Eriguchi | 1991-11-19 |