Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7397139 | Epoxy resin molding material for sealing use and semiconductor device | Ryoichi Ikezawa, Naoki Nara, Yoshihiro Mizukami, Yoshinori Endou, Takaki Kashihara +4 more | 2008-07-08 |