Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7397139 | Epoxy resin molding material for sealing use and semiconductor device | Ryoichi Ikezawa, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou, Takaki Kashihara +4 more | 2008-07-08 |
| 6211277 | Encapsulating material and LOC structure semiconductor device using the same | Tatsuo Kawata, Hiroki Sashima, Takaki Kashihara, Masanobu Fujii, Terumi Tsukahara +1 more | 2001-04-03 |
| 6005030 | Epoxy resin composition for semiconductor sealing and resin molded type semiconductor device sealed with the epoxy resin composition | Mitsuo TOGAWA, Kazuhiko Miyabayashi, Takahiro Horie | 1999-12-21 |