Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7397139 | Epoxy resin molding material for sealing use and semiconductor device | Ryoichi Ikezawa, Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou +4 more | 2008-07-08 |
| 6211277 | Encapsulating material and LOC structure semiconductor device using the same | Tatsuo Kawata, Hiroki Sashima, Masanobu Fujii, Naoki Nara, Terumi Tsukahara +1 more | 2001-04-03 |