Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6211277 | Encapsulating material and LOC structure semiconductor device using the same | Tatsuo Kawata, Takaki Kashihara, Masanobu Fujii, Naoki Nara, Terumi Tsukahara +1 more | 2001-04-03 |
| 5962139 | Semiconductor sealant of epoxy resin and organic polymer-grafted silicone polymer | Shinsuke Hagiwara, Hiroyuki Saitoh, Peter Huber, Bernward Deubzer, Michael Geck | 1999-10-05 |
| 5739217 | Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone | Shinsuke Hagiwara, Hiroyuki Saitoh, Peter Huber, Bernward Deubzer, Michael Geck | 1998-04-14 |
| 5567990 | Resin-encapsulated semiconductor device | Tatsuo Kawata, Hiroshi Suzuki, Kazuhiko Miyabayashi, Osamu Horie | 1996-10-22 |