Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8232355 | Liquid resin composition for electronic components and electronic component device | Hisato Takahashi, Hisashi Tsukahara, Kyouichi Tomita | 2012-07-31 |
| 7981977 | Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler | Kazuyoshi Tendou, Satoru Tsuchida | 2011-07-19 |
| 7982322 | Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same | Satoru Tsuchida, Kazuyoshi Tendou | 2011-07-19 |
| 7637571 | Vehicle seat assembly | Ritsuro Okano, Jun Aoki | 2009-12-29 |
| 7544727 | Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate | Ryoichi Ikezawa, Masanobu Fujii | 2009-06-09 |
| 7397139 | Epoxy resin molding material for sealing use and semiconductor device | Ryoichi Ikezawa, Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou +4 more | 2008-07-08 |
| 7187072 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata +2 more | 2007-03-06 |
| 6746897 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata +2 more | 2004-06-08 |
| 6713589 | Phenyl, naphthly or fluorene cyclopentyl epoxy resins | Haruaki Sue, Fumio Furusawa, Seiichi Akagi, Akihiro Kobayashi, Hideki Yokoyama | 2004-03-30 |
| 6365432 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata +2 more | 2002-04-02 |
| 6329492 | Phenyl, naphthyl or fluorene cyclopentyl epoxy resins | Haruaki Sue, Fumio Furusawa, Seiichi Akagi, Akihiro Kobayashi, Hideki Yokoyama | 2001-12-11 |
| 6235842 | Phase-separated carboxyl group-containing elastomer modified phoenoxy resin optionally with epoxy resin | Atsushi Kuwano | 2001-05-22 |
| 6207789 | Phenolic resin, resin composition, molding material for encapsulation, and electronic component device | Haruaki Sue, Fumio Furusawa, Seiichi Akagi, Kazuyoshi Tendo | 2001-03-27 |
| 5976912 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata +2 more | 1999-11-02 |
| 5962139 | Semiconductor sealant of epoxy resin and organic polymer-grafted silicone polymer | Hiroyuki Saitoh, Hiroki Sashima, Peter Huber, Bernward Deubzer, Michael Geck | 1999-10-05 |
| 5739217 | Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone | Hiroyuki Saitoh, Hiroki Sashima, Peter Huber, Bernward Deubzer, Michael Geck | 1998-04-14 |
| 5510446 | Method of preparing naphthol-modified phenolic resin and epoxy resin molding material for sealing electronic parts | Haruaki Sue, Hiroyuki Saitoh | 1996-04-23 |
| 5459223 | Method of preparing naphthol-modified phenolic resin | Haruaki Sue, Hiroyuki Saitoh | 1995-10-17 |
| 5449480 | Method of producing boards for printed wiring | Hiroyuki Kuriya | 1995-09-12 |
| 5319005 | Epoxy resin molding material for sealing of electronic component | Hiroyuki Kuriya, Shigeki Ichimura | 1994-06-07 |
| 5206333 | Method of producing a naphthol-modified phenolic resin of highly increased molecular weight | Haruaki Sue, Ken Nanaumi, Takuji Itou, Ken Madarame | 1993-04-27 |