Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7981977 | Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler | Satoru Tsuchida, Shinsuke Hagiwara | 2011-07-19 |
| 7982322 | Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same | Satoru Tsuchida, Shinsuke Hagiwara | 2011-07-19 |
| 7675185 | Epoxy resin molding material for sealing and electronic component | Mitsuo Katayose | 2010-03-09 |