Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8119737 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more | 2012-02-21 |
| 7947779 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer | Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more | 2011-05-24 |
| 7700185 | Insulation material, film, circuit board and method of producing them | Yasushi Kumashiro, Yoshitaka Hirata, Shin Takanezawa, Yasushi Shimada, Kazuhisa Otsuka +1 more | 2010-04-20 |
| 7592250 | Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device | Yasushi Shimada, Yoshitaka Hirata, Kazuhisa Otsuka, Masanori Yamaguchi, Yuichi Shimayama +4 more | 2009-09-22 |
| 7239013 | Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device | Yasushi Shimada, Yoshitaka Hirata, Kazuhisa Otsuka, Masanori Yamaguchi, Yuichi Shimayama +4 more | 2007-07-03 |
| 7070670 | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device | Takeo Tomiyama, Teiichi Inada, Masaaki Yasuda, Keiichi Hatakeyama, Yuuji Hasegawa +8 more | 2006-07-04 |
| 6889431 | Manufacturing method of electronic circuit including multilayer circuit board | Hiroshi Okabe, Hirozi Yamada, Eriko Takeda, Kazunori Yamamoto, Masanori Yamaguchi +3 more | 2005-05-10 |
| 6838170 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | Yuko Tanaka, Yasushi Shimada, Teiichi Inada, Kazunori Yamamoto, Yasushi Kumashiro +1 more | 2005-01-04 |
| 6673441 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | Yuko Tanaka, Yasushi Shimada, Teiichi Inada, Kazunori Yamamoto, Yasushi Kumashiro +1 more | 2004-01-06 |
| 6621170 | Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film | Kazunori Yamamoto, Yasushi Shimada, Yasushi Kumashiro, Teiichi Inada, Aizo Kaneda +5 more | 2003-09-16 |
| 6265782 | Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film | Kazunori Yamamoto, Yasushi Shimada, Yasushi Kumashiro, Teiichi Inada, Aizo Kaneda +5 more | 2001-07-24 |
| 5449480 | Method of producing boards for printed wiring | Shinsuke Hagiwara | 1995-09-12 |
| 5319005 | Epoxy resin molding material for sealing of electronic component | Shinsuke Hagiwara, Shigeki Ichimura | 1994-06-07 |