TI

Tetsurou Iwakura

HC Hitachi Chemical Company: 5 patents #314 of 1,946Top 20%
RE Resonac: 1 patents #191 of 474Top 45%
SC Showa Denko Materials Co.: 1 patents #135 of 270Top 50%
📍 Tsukuba, JP: #565 of 2,818 inventorsTop 25%
Overall (All Time): #707,150 of 4,157,543Top 20%
7
Patents All Time

Issued Patents All Time

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDate
11827789 Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof Aya Kasahara 2023-11-28
11331888 Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor Aya Kasahara 2022-05-17
9212298 Adhesive sheet and method for manufacturing semiconductor device Megumi Kodama, Takahiro Tokuyasu 2015-12-15
8200059 Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them Tomoaki Shibata, Atsushi Takahashi, Keisuke Ookubo 2012-06-12
8119737 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Hiroyuki Kawakami, Masao Suzuki +6 more 2012-02-21
7947779 Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Hiroyuki Kawakami, Masao Suzuki +6 more 2011-05-24
7070670 Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device Takeo Tomiyama, Teiichi Inada, Masaaki Yasuda, Keiichi Hatakeyama, Yuuji Hasegawa +8 more 2006-07-04