KH

Keiichi Hatakeyama

HC Hitachi Chemical Company: 9 patents #162 of 1,946Top 9%
FC Furukawa Electric Co.: 1 patents #1,242 of 2,370Top 55%
KO Konami: 1 patents #203 of 445Top 50%
Overall (All Time): #438,112 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
12362248 Method for manufacturing semiconductor device, semiconductor device, and semiconductor member Goki Toshima, Masaaki TAKEKOSHI 2025-07-15
8404564 Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them Yuuki Nakamura, Tsutomu Kitakatsu, Youji Katayama 2013-03-26
8232185 Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film Yuuki Nakamura, Tsutomu Kitakatsu, Youji Katayama 2012-07-31
8198176 Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device Yuuki Nakamura 2012-06-12
8119737 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more 2012-02-21
8071465 Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device Yuuki Nakamura 2011-12-06
8034659 Production method of semiconductor device and bonding film Akira Nagai, Masaaki Yasuda, Tetsuya Enomoto 2011-10-11
7947779 Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more 2011-05-24
7517724 Dicing/die bonding sheet Michio Uruno, Takayuki Matsuzaki, Yasumasa Morishima, Kenji Kita, Shinichi Ishiwata 2009-04-14
7070670 Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device Takeo Tomiyama, Teiichi Inada, Masaaki Yasuda, Yuuji Hasegawa, Masaya Nishiyama +8 more 2006-07-04
6602132 Game system and computer-readable storage medium carrying program therefor Akira Kozawa, Kengo Suzuki, Seiji Akimoto, Yasuhiro Masuoka, Akihiro Shimizu +2 more 2003-08-05