Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9324592 | Wafer processing tape | Hiromitsu Maruyama, Shuzo Taguchi, Noboru Sakuma, Yasumasa Morishima | 2016-04-26 |
| 9324593 | Wafer processing tape | Hiromitsu Maruyama, Noboru Sakuma, Yasumasa Morishima | 2016-04-26 |
| 8722184 | Wafer-adhering adhesive tape | Yasumasa Morishima, Kenji Kita | 2014-05-13 |
| 8545979 | Wafer-processing tape and method of producing the same | Kenji Kita, Yasumasa Morishima | 2013-10-01 |
| 8043698 | Method of producing a semiconductor device, and wafer-processing tape | Yasumasa Morishima, Kenji Kita, Takanori Yamakawa | 2011-10-25 |
| D628170 | Semiconductor wafer processing tape | Hiromitsu Maruyama, Shuzo Taguchi, Yasumasa Morishima | 2010-11-30 |
| D621803 | Semiconductor wafer processing tape | Hiromitsu Maruyama, Shuzo Taguchi, Yasumasa Morishima | 2010-08-17 |
| 7517724 | Dicing/die bonding sheet | Keiichi Hatakeyama, Michio Uruno, Takayuki Matsuzaki, Yasumasa Morishima, Kenji Kita | 2009-04-14 |
| 7413965 | Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape | Masakatsu Inada | 2008-08-19 |
| 5538771 | Semiconductor wafer-securing adhesive tape | Koji Nakayama, Kenji Mougi, Eiji Shiramatsu, Kazushige Iwamoto, Morikuni Hasebe | 1996-07-23 |
| 5300172 | Surface-protection method during etching | Kazushige Iwamoto, Michio Ueyama, Isamu Noguchi | 1994-04-05 |
| 5281473 | Radiation-curable adhesive tape | Michio Ueyama, Hiroyuki Nakae, Yoshiyuki Funayama, Kazushige Iwamoto, Isamu Noguchi | 1994-01-25 |
| 5149586 | Radiation-curable adhesive tape | Michio Ueyama, Hiroyuki Nakae, Yoshiyuki Funayama, Kazushige Iwamoto, Isamu Noguchi | 1992-09-22 |
| 4999242 | Radiation-curable adhesive tape | Michio Ueyama, Hiroyuki Nakae, Yoshiyuki Funayama, Kazushige Iwamoto, Isamu Noguchi | 1991-03-12 |