Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11203673 | Thermoplastic composite material and formed body | Motoko Yoshizaki, Makiko Nakano, Takayori Ito, Yukihiro IKURA, Takahiro Iida +1 more | 2021-12-21 |
| 9741498 | Current collector, electrode, secondary battery and capacitor | Takahiro Iida, Takayori Ito, Hidekazu Hara, Tsugio Kataoka, Mitsuya Inoue +5 more | 2017-08-22 |
| 9324592 | Wafer processing tape | Hiromitsu Maruyama, Shuzo Taguchi, Noboru Sakuma, Shinichi Ishiwata | 2016-04-26 |
| 9324593 | Wafer processing tape | Hiromitsu Maruyama, Noboru Sakuma, Shinichi Ishiwata | 2016-04-26 |
| 8722184 | Wafer-adhering adhesive tape | Kenji Kita, Shinichi Ishiwata | 2014-05-13 |
| 8545979 | Wafer-processing tape and method of producing the same | Kenji Kita, Shinichi Ishiwata | 2013-10-01 |
| 8043698 | Method of producing a semiconductor device, and wafer-processing tape | Kenji Kita, Shinichi Ishiwata, Takanori Yamakawa | 2011-10-25 |
| D628170 | Semiconductor wafer processing tape | Hiromitsu Maruyama, Shuzo Taguchi, Shinichi Ishiwata | 2010-11-30 |
| D621803 | Semiconductor wafer processing tape | Hiromitsu Maruyama, Shuzo Taguchi, Shinichi Ishiwata | 2010-08-17 |
| 7517724 | Dicing/die bonding sheet | Keiichi Hatakeyama, Michio Uruno, Takayuki Matsuzaki, Kenji Kita, Shinichi Ishiwata | 2009-04-14 |