Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9327418 | Adhesive film | Kouhei Horiuchi, Hiroaki Takahashi, Tomoyuki Nakamura, Mitsuyoshi SHIMAMURA | 2016-05-03 |
| 9034449 | Adhesive film | Kouhei Horiuchi, Junichi Imaizumi, Seiji Sunohara, Yasushi Numaguchi | 2015-05-19 |
| 8617930 | Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device | Teiichi Inada, Michio Mashino | 2013-12-31 |
| 8470115 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | Maiko Tanaka, Takayuki Matsuzaki, Ryoji Furutani, Michio Mashino, Teiichi Inada | 2013-06-25 |
| 8465615 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | Maiko Tanaka, Takayuki Matsuzaki, Ryoji Furutani, Michio Mashino, Teiichi Inada | 2013-06-18 |
| 8017444 | Adhesive sheet, semiconductor device, and process for producing semiconductor device | Teiichi Inada, Michio Mashino, Tetsuro Iwakura | 2011-09-13 |
| 7968194 | Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler | Teiichi Inada, Michio Mashino | 2011-06-28 |
| 7968195 | Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler | Teiichi Inada, Michio Mashino | 2011-06-28 |
| 7875500 | Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support | Teiichi Inada, Michio Mashino | 2011-01-25 |
| 7517724 | Dicing/die bonding sheet | Keiichi Hatakeyama, Takayuki Matsuzaki, Yasumasa Morishima, Kenji Kita, Shinichi Ishiwata | 2009-04-14 |
| 7070670 | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device | Takeo Tomiyama, Teiichi Inada, Masaaki Yasuda, Keiichi Hatakeyama, Yuuji Hasegawa +8 more | 2006-07-04 |