Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825694 | Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection | Yushi Yamaguchi, Takuji IKEYA, Shogo SOBUE, Yasuyuki OOYAMA | 2020-11-03 |
| 9011624 | Adhesive sheet and method for manufacturing adhesive sheets | Takahiro Tokuyasu, Shinya Katou, Rie Katou, Tomohito Yuasa, Kouji Komorida +1 more | 2015-04-21 |
| 8975161 | Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method | Rie Katou, Takayuki Matsuzaki, Shinya Katou, Tatsuya Sakuta, Kouji Komorida | 2015-03-10 |
| 8470115 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | Maiko Tanaka, Michio Uruno, Takayuki Matsuzaki, Michio Mashino, Teiichi Inada | 2013-06-25 |
| 8465615 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | Maiko Tanaka, Michio Uruno, Takayuki Matsuzaki, Michio Mashino, Teiichi Inada | 2013-06-18 |