Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10233324 | Epoxy resin composition | Yukihiro Harada, Satoshi Okamoto, Kenta Narumori, Tomoo Sano, Akihiro Ito +3 more | 2019-03-19 |
| D804435 | Flap in an adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2017-12-05 |
| 9190309 | Tape for processing wafer, method for manufacturing tape for processing | Kouhei Taniguchi, Takayuki Matsuzaki, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2015-11-17 |
| 9076833 | Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device | Kouhei Taniguchi, Takayuki Matsuzaki, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2015-07-07 |
| 9076832 | Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device | Kouhei Taniguchi, Takayuki Matsuzaki, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2015-07-07 |
| 9011624 | Adhesive sheet and method for manufacturing adhesive sheets | Ryoji Furutani, Takahiro Tokuyasu, Rie Katou, Tomohito Yuasa, Kouji Komorida +1 more | 2015-04-21 |
| 8975161 | Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method | Rie Katou, Takayuki Matsuzaki, Ryoji Furutani, Tatsuya Sakuta, Kouji Komorida | 2015-03-10 |
| D690278 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2013-09-24 |
| D689831 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2013-09-17 |
| D680505 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2013-04-23 |
| D664511 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2012-07-31 |
| D664512 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2012-07-31 |
| D656909 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2012-04-03 |
| D656910 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2012-04-03 |
| 6806436 | Series spot welding method, device for carrying out the method, and electrodes employed in the method or the device | Seiichi Kamiya, Kazuhiro Noma | 2004-10-19 |