Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9969909 | Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor | Masaki Yamada | 2018-05-15 |
| D804435 | Flap in an adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Tatsuya Sakuta +1 more | 2017-12-05 |
| 9190309 | Tape for processing wafer, method for manufacturing tape for processing | Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Tatsuya Sakuta +1 more | 2015-11-17 |
| 9076832 | Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device | Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Tatsuya Sakuta +1 more | 2015-07-07 |
| 9076833 | Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device | Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Tatsuya Sakuta +1 more | 2015-07-07 |
| 8617930 | Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device | Teiichi Inada, Michio Uruno | 2013-12-31 |
| D690278 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Tatsuya Sakuta +1 more | 2013-09-24 |
| D689831 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Tatsuya Sakuta +1 more | 2013-09-17 |
| 8470115 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | Maiko Tanaka, Michio Uruno, Takayuki Matsuzaki, Ryoji Furutani, Teiichi Inada | 2013-06-25 |
| 8465615 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | Maiko Tanaka, Michio Uruno, Takayuki Matsuzaki, Ryoji Furutani, Teiichi Inada | 2013-06-18 |
| D680505 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Tatsuya Sakuta +1 more | 2013-04-23 |
| D664511 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Tatsuya Sakuta +1 more | 2012-07-31 |
| D664512 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Tatsuya Sakuta +1 more | 2012-07-31 |
| D656909 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Tatsuya Sakuta +1 more | 2012-04-03 |
| D656910 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Tatsuya Sakuta +1 more | 2012-04-03 |
| 8017444 | Adhesive sheet, semiconductor device, and process for producing semiconductor device | Teiichi Inada, Michio Uruno, Tetsuro Iwakura | 2011-09-13 |
| 7968194 | Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler | Teiichi Inada, Michio Uruno | 2011-06-28 |
| 7968195 | Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler | Teiichi Inada, Michio Uruno | 2011-06-28 |
| 7875500 | Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support | Teiichi Inada, Michio Uruno | 2011-01-25 |