Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535782 | Resin member and sheet using same, and heat storage material and heat control sheet using same | Akira Nagai, Tsuyoshi Morimoto | 2022-12-27 |
| 11441022 | Resin member and sheet using same, method for producing resin member, and heat storage material and heat control sheet using same | Akira Nagai, Tsuyoshi Morimoto | 2022-09-13 |
| 8840811 | Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same | Yuusuke Yasuda, Toshiaki Morita, Eiichi Ide | 2014-09-23 |
| 8617930 | Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device | Michio Mashino, Michio Uruno | 2013-12-31 |
| 8470115 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | Maiko Tanaka, Michio Uruno, Takayuki Matsuzaki, Ryoji Furutani, Michio Mashino | 2013-06-25 |
| 8465615 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | Maiko Tanaka, Michio Uruno, Takayuki Matsuzaki, Ryoji Furutani, Michio Mashino | 2013-06-18 |
| 8119737 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami, Masao Suzuki +6 more | 2012-02-21 |
| 8017444 | Adhesive sheet, semiconductor device, and process for producing semiconductor device | Michio Mashino, Michio Uruno, Tetsuro Iwakura | 2011-09-13 |
| 8012580 | Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device | Keisuke Ookubo | 2011-09-06 |
| 8003207 | Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device | Keisuke Ookubo | 2011-08-23 |
| 7968194 | Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler | Michio Mashino, Michio Uruno | 2011-06-28 |
| 7968195 | Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler | Michio Mashino, Michio Uruno | 2011-06-28 |
| 7947779 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer | Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami, Masao Suzuki +6 more | 2011-05-24 |
| 7875500 | Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support | Michio Mashino, Michio Uruno | 2011-01-25 |
| 7772317 | Resin molding material | Michiko KAYA, Hiroto Oda | 2010-08-10 |
| 7578891 | Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device | Keisuke Ookubo | 2009-08-25 |
| 7070670 | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device | Takeo Tomiyama, Masaaki Yasuda, Keiichi Hatakeyama, Yuuji Hasegawa, Masaya Nishiyama +8 more | 2006-07-04 |
| 6838170 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | Yuko Tanaka, Yasushi Shimada, Hiroyuki Kuriya, Kazunori Yamamoto, Yasushi Kumashiro +1 more | 2005-01-04 |
| 6673441 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | Yuko Tanaka, Yasushi Shimada, Hiroyuki Kuriya, Kazunori Yamamoto, Yasushi Kumashiro +1 more | 2004-01-06 |
| 6621170 | Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film | Kazunori Yamamoto, Yasushi Shimada, Yasushi Kumashiro, Hiroyuki Kuriya, Aizo Kaneda +5 more | 2003-09-16 |
| 6265782 | Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film | Kazunori Yamamoto, Yasushi Shimada, Yasushi Kumashiro, Hiroyuki Kuriya, Aizo Kaneda +5 more | 2001-07-24 |
| 6184577 | Electronic component parts device | Kenzo Takemura, Itsuo Watanabe, Akira Nagai, Osamu Watanabe, Kazuyoshi Kojima +4 more | 2001-02-06 |
| 6090468 | Multilayer wiring board for mounting semiconductor device and method of producing the same | Yasushi Shimada, Yasushi Kumashiro, Kazunori Yamamoto | 2000-07-18 |
| 5965269 | Adhesive, adhesive film and adhesive-backed metal foil | Kazunori Yamamoto, Yasushi Shimada, Yasushi Kumashiro | 1999-10-12 |
| 5935452 | Resin composition and its use in production of multilayer printed circuit board | Yoshiyuki Tsuru, Shin Takanezawa | 1999-08-10 |