Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8119737 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more | 2012-02-21 |
| 7947779 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer | Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more | 2011-05-24 |
| 7700185 | Insulation material, film, circuit board and method of producing them | Yasushi Kumashiro, Yoshitaka Hirata, Shin Takanezawa, Kazuhisa Otsuka, Hiroyuki Kuriya +1 more | 2010-04-20 |
| 7592250 | Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device | Yoshitaka Hirata, Hiroyuki Kuriya, Kazuhisa Otsuka, Masanori Yamaguchi, Yuichi Shimayama +4 more | 2009-09-22 |
| 7239013 | Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device | Yoshitaka Hirata, Hiroyuki Kuriya, Kazuhisa Otsuka, Masanori Yamaguchi, Yuichi Shimayama +4 more | 2007-07-03 |
| 7070670 | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device | Takeo Tomiyama, Teiichi Inada, Masaaki Yasuda, Keiichi Hatakeyama, Yuuji Hasegawa +8 more | 2006-07-04 |
| 6889431 | Manufacturing method of electronic circuit including multilayer circuit board | Hiroshi Okabe, Hirozi Yamada, Eriko Takeda, Kazunori Yamamoto, Hiroyuki Kuriya +3 more | 2005-05-10 |
| 6838170 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | Yuko Tanaka, Teiichi Inada, Hiroyuki Kuriya, Kazunori Yamamoto, Yasushi Kumashiro +1 more | 2005-01-04 |
| 6673441 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | Yuko Tanaka, Teiichi Inada, Hiroyuki Kuriya, Kazunori Yamamoto, Yasushi Kumashiro +1 more | 2004-01-06 |
| 6621170 | Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film | Kazunori Yamamoto, Yasushi Kumashiro, Teiichi Inada, Hiroyuki Kuriya, Aizo Kaneda +5 more | 2003-09-16 |
| 6265782 | Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film | Kazunori Yamamoto, Yasushi Kumashiro, Teiichi Inada, Hiroyuki Kuriya, Aizo Kaneda +5 more | 2001-07-24 |
| 6184577 | Electronic component parts device | Kenzo Takemura, Itsuo Watanabe, Akira Nagai, Osamu Watanabe, Kazuyoshi Kojima +4 more | 2001-02-06 |
| 6090468 | Multilayer wiring board for mounting semiconductor device and method of producing the same | Yasushi Kumashiro, Teiichi Inada, Kazunori Yamamoto | 2000-07-18 |
| 5965269 | Adhesive, adhesive film and adhesive-backed metal foil | Teiichi Inada, Kazunori Yamamoto, Yasushi Kumashiro | 1999-10-12 |
| 5323534 | Process for producing coaxial conductor interconnection wiring board | Yorio Iwasaki, Toshiro Okamura, Shigeharu Arike, Hiroharu Kamiyama, Eisaku Namai +1 more | 1994-06-28 |
| 5233133 | Coaxial conductor interconnection wiring board | Yorio Iwasaki, Toshiro Okamura, Shigeharu Arike, Hiroharu Kamiyama, Eisaku Namai +1 more | 1993-08-03 |