Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9676969 | Composition set, conductive substrate and method of producing the same, and conductive adhesive composition | Hideo Nakako, Kazunori Yamamoto, Shunya Yokosawa, Takaaki Noudou, Maki Inada +1 more | 2017-06-13 |
| 9650528 | Liquid composition, and resistor film, resistor element and circuit board | Naoki Maruyama, Maki Inada | 2017-05-16 |
| 9550940 | Etching material | Hideo Nakako, Takaaki Noudou, Maki Inada, Kyoko Kuroda | 2017-01-24 |
| 9457406 | Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition | Hideo Nakako, Kazunori Yamamoto, Shunya Yokosawa, Katsuyuki Masuda, Yoshinori Ejiri +2 more | 2016-10-04 |
| 9228100 | Liquid composition, and resistor film, resistor element and circuit board using same | Naoki Maruyama, Maki Inada | 2016-01-05 |
| 8801971 | Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution | Hideo Nakako, Kazunori Yamamoto, Youichi Machii, Shunya Yokozawa, Yoshinori Ejiri +1 more | 2014-08-12 |
| 8040486 | Ink for forming liquid crystal spacer and liquid crystal display device using such ink | Naoki Maruyama, Kazunori Yamamoto | 2011-10-18 |
| 7700185 | Insulation material, film, circuit board and method of producing them | Yoshitaka Hirata, Shin Takanezawa, Yasushi Shimada, Kazuhisa Otsuka, Hiroyuki Kuriya +1 more | 2010-04-20 |
| 6838170 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | Yuko Tanaka, Yasushi Shimada, Teiichi Inada, Hiroyuki Kuriya, Kazunori Yamamoto +1 more | 2005-01-04 |
| 6673441 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | Yuko Tanaka, Yasushi Shimada, Teiichi Inada, Hiroyuki Kuriya, Kazunori Yamamoto +1 more | 2004-01-06 |
| 6621170 | Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film | Kazunori Yamamoto, Yasushi Shimada, Teiichi Inada, Hiroyuki Kuriya, Aizo Kaneda +5 more | 2003-09-16 |
| 6265782 | Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film | Kazunori Yamamoto, Yasushi Shimada, Teiichi Inada, Hiroyuki Kuriya, Aizo Kaneda +5 more | 2001-07-24 |
| 6197149 | Production of insulating varnishes and multilayer printed circuit boards using these varnishes | Kazuhito Kobayashi, Atsushi Takahashi, Koji Morita, Takahiro Tanabe, Kazunori Yamamoto +6 more | 2001-03-06 |
| 6090468 | Multilayer wiring board for mounting semiconductor device and method of producing the same | Yasushi Shimada, Teiichi Inada, Kazunori Yamamoto | 2000-07-18 |
| 5965269 | Adhesive, adhesive film and adhesive-backed metal foil | Teiichi Inada, Kazunori Yamamoto, Yasushi Shimada | 1999-10-12 |