Issued Patents All Time
Showing 25 most recent of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12407269 | Semiconductor device, busbar, and power converter | Junpei Kusukawa, Masahito Mochizuki | 2025-09-02 |
| 12283536 | Power semiconductor device and manufacturing method of power semiconductor device | Hiromi Shimazu, Yujiro Kaneko, Yusuke Takagi, Hisashi Tanie | 2025-04-22 |
| 12132014 | Power semiconductor apparatus | Junpei Kusukawa | 2024-10-29 |
| 12095382 | Semiconductor device, electric power conversion device, and manufacturing method of semiconductor device | Junpei Kusukawa, Nobutake Tsuyuno | 2024-09-17 |
| 11967584 | Power semiconductor device | Hiromi Shimazu, Yujiro Kaneko, Toru Kato, Akira Matsushita | 2024-04-23 |
| 10818573 | Power semiconductor module with heat dissipation plate | Nobutake Tsuyuno, Takeshi Tokuyama | 2020-10-27 |
| 10701842 | Power converter having water passages for cooling power modules | Akitoyo Konno, Shinji Sugimoto | 2020-06-30 |
| 10194563 | Power conversion device | Nobutake Tsuyuno, Takeshi Tokuyama | 2019-01-29 |
| 10177069 | Heat-dissipating structure and semiconductor module using same | Takashi Naito, Motomune Kodama, Takuya Aoyagi, Shigeru Kikuchi, Takashi Nogawa +6 more | 2019-01-08 |
| 10177084 | Semiconductor module and method of manufacturing semiconductor module | Nobutake Tsuyuno | 2019-01-08 |
| 10080313 | Power module and method for manufacturing the same | Hiroshi Shintani, Koji Sasaki, Hisashi Tanie | 2018-09-18 |
| 10064310 | Power-module device, power conversion device, and method for manufacturing power-module device | Hisashi Tanie, Hiroshi Shintani, Atsuo Nishihara | 2018-08-28 |
| 9870974 | Power conversion apparatus including wedge inserts | Hiroshi Shintani, Hisashi Tanie | 2018-01-16 |
| 9852962 | Waterproof electronic device and manufacturing method thereof | Hiroyuki Temmei, Mina Amo, Nobutake Tsuyuno, Takeshi Tokuyama, Toshiya Satoh +2 more | 2017-12-26 |
| 9591789 | Power semiconductor module and power module | Eiji Nishioka, Toshiaki Ishii, Junpei Kusukawa, Kinya Nakatsu, Nobutake Tsuyuno +2 more | 2017-03-07 |
| 9530722 | Semiconductor device and production method for same | Shiro Yamashita, Hideto Yoshinari, Takashi Kume, Shinichi Fujino | 2016-12-27 |
| 9439332 | Power module | Eiji Nishioka, Toshiaki Ishii, Junpei Kusukawa, Kinya Nakatsu, Tokihito Suwa | 2016-09-06 |
| 9076780 | Power module and lead frame for power module | Yoshinori Negishi, Hiroshi Nakano, Haruo Akahoshi, Motoko Harada, Toshiaki Ishii | 2015-07-07 |
| 8952525 | Semiconductor module and method for manufacturing semiconductor module | Takeshi Tokuyama, Nobutake Tsuyuno, Kinya Nakatsu, Tokihito Suwa, Yuujiro Kaneko | 2015-02-10 |
| 8912644 | Semiconductor device and method for manufacturing same | Toshiaki Morita | 2014-12-16 |
| 8847374 | Power semiconductor module and manufacturing method thereof | Shinji Hiramitsu, Hiroshi Hozoji, Nobutake Tsuyuno, Kinya Nakatsu, Takeshi Tokuyama +2 more | 2014-09-30 |
| 8840811 | Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same | Yuusuke Yasuda, Toshiaki Morita, Teiichi Inada | 2014-09-23 |
| 8821768 | Bonding method and bonding material using metal particle | Yusuke Yasuda, Toshiaki Morita, Hiroshi Hozoji, Toshiaki Ishii | 2014-09-02 |
| 8821676 | Low temperature bonding material comprising coated metal nanoparticles, and bonding method | Yusuke Yasuda, Toshiaki Morita, Hiroshi Hozoji, Toshiaki Ishii | 2014-09-02 |
| 8592996 | Semiconductor device and method of manufacturing the same | Toshiaki Morita, Yusuke Yasuda | 2013-11-26 |