| 12506046 |
Electric circuit body, power converter, and method for manufacturing electric circuit body |
Nobutake Tsuyuno, Yujiro Kaneko, Akira Matsushita, Makoto Mochizuki, Junpei Kusukawa |
2025-12-23 |
|
| 12407269 |
Semiconductor device, busbar, and power converter |
Junpei Kusukawa, Masahito Mochizuki |
2025-09-02 |
|
| 12283536 |
Power semiconductor device and manufacturing method of power semiconductor device |
Hiromi Shimazu, Yujiro Kaneko, Yusuke Takagi, Hisashi Tanie |
2025-04-22 |
|
| 12132014 |
Power semiconductor apparatus |
Junpei Kusukawa |
2024-10-29 |
|
| 12095382 |
Semiconductor device, electric power conversion device, and manufacturing method of semiconductor device |
Junpei Kusukawa, Nobutake Tsuyuno |
2024-09-17 |
|
| 11967584 |
Power semiconductor device |
Hiromi Shimazu, Yujiro Kaneko, Toru Kato, Akira Matsushita |
2024-04-23 |
|
| 10818573 |
Power semiconductor module with heat dissipation plate |
Nobutake Tsuyuno, Takeshi Tokuyama |
2020-10-27 |
|
| 10701842 |
Power converter having water passages for cooling power modules |
Akitoyo Konno, Shinji Sugimoto |
2020-06-30 |
|
| 10194563 |
Power conversion device |
Nobutake Tsuyuno, Takeshi Tokuyama |
2019-01-29 |
|
| 10177069 |
Heat-dissipating structure and semiconductor module using same |
Takashi Naito, Motomune Kodama, Takuya Aoyagi, Shigeru Kikuchi, Takashi Nogawa +6 more |
2019-01-08 |
|
| 10177084 |
Semiconductor module and method of manufacturing semiconductor module |
Nobutake Tsuyuno |
2019-01-08 |
|
| 10080313 |
Power module and method for manufacturing the same |
Hiroshi Shintani, Koji Sasaki, Hisashi Tanie |
2018-09-18 |
|
| 10064310 |
Power-module device, power conversion device, and method for manufacturing power-module device |
Hisashi Tanie, Hiroshi Shintani, Atsuo Nishihara |
2018-08-28 |
|
| 9870974 |
Power conversion apparatus including wedge inserts |
Hiroshi Shintani, Hisashi Tanie |
2018-01-16 |
|
| 9852962 |
Waterproof electronic device and manufacturing method thereof |
Hiroyuki Temmei, Mina Amo, Nobutake Tsuyuno, Takeshi Tokuyama, Toshiya Satoh +2 more |
2017-12-26 |
|
| 9591789 |
Power semiconductor module and power module |
Eiji Nishioka, Toshiaki Ishii, Junpei Kusukawa, Kinya Nakatsu, Nobutake Tsuyuno +2 more |
2017-03-07 |
|
| 9530722 |
Semiconductor device and production method for same |
Shiro Yamashita, Hideto Yoshinari, Takashi Kume, Shinichi Fujino |
2016-12-27 |
|
| 9439332 |
Power module |
Eiji Nishioka, Toshiaki Ishii, Junpei Kusukawa, Kinya Nakatsu, Tokihito Suwa |
2016-09-06 |
|
| 9076780 |
Power module and lead frame for power module |
Yoshinori Negishi, Hiroshi Nakano, Haruo Akahoshi, Motoko Harada, Toshiaki Ishii |
2015-07-07 |
|
| 8952525 |
Semiconductor module and method for manufacturing semiconductor module |
Takeshi Tokuyama, Nobutake Tsuyuno, Kinya Nakatsu, Tokihito Suwa, Yuujiro Kaneko |
2015-02-10 |
|
| 8912644 |
Semiconductor device and method for manufacturing same |
Toshiaki Morita |
2014-12-16 |
|
| 8847374 |
Power semiconductor module and manufacturing method thereof |
Shinji Hiramitsu, Hiroshi Hozoji, Nobutake Tsuyuno, Kinya Nakatsu, Takeshi Tokuyama +2 more |
2014-09-30 |
|
| 8840811 |
Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same |
Yuusuke Yasuda, Toshiaki Morita, Teiichi Inada |
2014-09-23 |
|
| 8821768 |
Bonding method and bonding material using metal particle |
Yusuke Yasuda, Toshiaki Morita, Hiroshi Hozoji, Toshiaki Ishii |
2014-09-02 |
|
| 8821676 |
Low temperature bonding material comprising coated metal nanoparticles, and bonding method |
Yusuke Yasuda, Toshiaki Morita, Hiroshi Hozoji, Toshiaki Ishii |
2014-09-02 |
|
