Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12090564 | Copper-ceramic joint body, brazing member and method of manufacturing copper-ceramic joint body | Shun Takano, Kenji Okishiro, Atsushi Okamoto | 2024-09-17 |
| 11877513 | Method for manufacturing thermoelectric conversion module | Tomotake TOHEI, Nan Wang, Michiko Matsuda, Takeshi Shimada | 2024-01-16 |
| 10177069 | Heat-dissipating structure and semiconductor module using same | Takashi Naito, Motomune Kodama, Takuya Aoyagi, Shigeru Kikuchi, Mutsuhiro Mori +6 more | 2019-01-08 |