Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068552 | Circuit board assembly | Shinya Kawakita, Toshikazu Shigyo | 2024-08-20 |
| 11266044 | Electronic control device | Isamu Yoshida, Masaru Kamoshida, Toshikazu Shigyo | 2022-03-01 |
| 10154589 | Electronic control device | Miki Hiraoka, Tomishige Yatsugi | 2018-12-11 |
| 9960147 | Power module | Yusuke Takagi, Takahiro Shimura | 2018-05-01 |
| 9530722 | Semiconductor device and production method for same | Hideto Yoshinari, Takashi Kume, Shinichi Fujino, Eiichi Ide | 2016-12-27 |
| 9306020 | Power module and method of manufacturing the power module | Shinichi Fujino, Hideto Yoshinari | 2016-04-05 |
| 8796563 | Connection structure, power module and method of manufacturing the same | Ukyo Ikeda, Masato Nakamura | 2014-08-05 |
| 7883378 | Electronic device and on-vehicle module | Hideto Yoshinari | 2011-02-08 |
| 7719100 | Power semiconductor module with MOS chip | Shinichi Fujiwara, Shosaku Ishihara, Hideto Yoshinari | 2010-05-18 |
| 7554039 | Electronic device | Takehide Yokozuka, Masahide Harada, Kaoru Uchiyama, Shuji Eguchi, Masahiko Asano +1 more | 2009-06-30 |
| 7498671 | Power semiconductor module | Shinichi Fujiwara, Masahide Harada, Hideto Yoshinari, Shosaku Ishihara, Isamu Yoshida +1 more | 2009-03-03 |
| 7445455 | Electronic device | Takehide Yokozuka, Masahide Harada, Isamu Yoshida, Masahiko Asano, Koji Sato +2 more | 2008-11-04 |
| 7401393 | Method for removing solder bumps from LSI | Motoko Kimura, Takeshi Miitsu, Takeshi Takahashi, Kaoru Katayama | 2008-07-22 |
| 7217645 | Method for manufacturing semiconductor device and electronic device and method for calculating connection condition | Masahide Harada, Kenichi Yamamoto, Munehiro Yamada, Ryosuke Kimoto | 2007-05-15 |
| 7211892 | Semiconductor device having a particular electrode structure | Yoichi Abe, Kenichi Yamamoto, Ryosuke Kimoto, Hiroshi Kawakubo | 2007-05-01 |
| 6943951 | Optical component and dispersion compensation method | Kazuro Kikuchi, Yuichi Takushima, Mark Jablonski, Yuichi Tanaka, Haruki Kataoka +4 more | 2005-09-13 |
| 6739045 | Method for removing solder bumps from LSI | Motoko Kimura, Takeshi Miitsu, Takeshi Takahashi, Kaoru Katayama | 2004-05-25 |
| 5906797 | Treatment of NF.sub.3 -containing gases | Ituo Orihara, Moriyuki Fukushima, Eisaku Mogi | 1999-05-25 |
| 5879646 | Treatment of NH.sub.3 -containing gases | Ithuo Orihara, Moriyuki Fukushima, Eisaku Mogi | 1999-03-09 |
| 4986131 | Semiconductor strain detector | Susumu Sugiyama, Hirofumi Funabashi | 1991-01-22 |
| 4306170 | AT-Cut quartz resonator, with w/t=2.0 to 2.8, l/t<25 | Shunichi Motte, Naoyuki Echigo, Tsuneo Kuwabara, Kunihiro Takahashi | 1981-12-15 |
| 4247797 | Rectangular AT-cut quartz resonator | Naoyuki Echigo, Tsuneo Kuwabara, Kunihiro Takahashi, Shunichi Motte | 1981-01-27 |