Issued Patents All Time
Showing 1–25 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847614 | Semiconductor device having a stacked electrode with an electroless nickel plating layer | Tomoyasu Furukawa, Daisuke Kawase, Toshihito Tabata | 2020-11-24 |
| 10763346 | Semiconductor device and power conversion apparatus | Tomoyasu Furukawa, Masaki Shiraishi | 2020-09-01 |
| 10522638 | Semiconductor chip and power module, and manufacturing method of the same | Masakazu Sagawa, Takahiro Morikawa, Motoyuki Miyata, Kan Yasui | 2019-12-31 |
| 10177069 | Heat-dissipating structure and semiconductor module using same | Takashi Naito, Motomune Kodama, Takuya Aoyagi, Shigeru Kikuchi, Takashi Nogawa +6 more | 2019-01-08 |
| 9404010 | Method for forming multilayer coating film | Naoyuki Iwata, Fumio Yamashita, Minoru Ishikura, Takashi Nakayabu, Kazushi Konishi +1 more | 2016-08-02 |
| 8912644 | Semiconductor device and method for manufacturing same | Eiichi Ide | 2014-12-16 |
| 8840811 | Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same | Yuusuke Yasuda, Eiichi Ide, Teiichi Inada | 2014-09-23 |
| 8821768 | Bonding method and bonding material using metal particle | Yusuke Yasuda, Eiichi Ide, Hiroshi Hozoji, Toshiaki Ishii | 2014-09-02 |
| 8821676 | Low temperature bonding material comprising coated metal nanoparticles, and bonding method | Yusuke Yasuda, Eiichi Ide, Hiroshi Hozoji, Toshiaki Ishii | 2014-09-02 |
| 8635710 | Scanning probe microscope and method of observing sample using the same | Toshihiko Nakata, Masahiro Watanabe, Takashi Inoue, Kishio Hidaka, Makoto Okai +1 more | 2014-01-21 |
| 8592996 | Semiconductor device and method of manufacturing the same | Yusuke Yasuda, Eiichi Ide | 2013-11-26 |
| 8513534 | Semiconductor device and bonding material | Yusuke Yasuda, Eiichi Ide | 2013-08-20 |
| 8455986 | Mosfet package | Ryoichi Kajiwara, Masahiro Koizumi, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2013-06-04 |
| 8400777 | Electronic member, electronic part and manufacturing method therefor | Eiichi Ide, Yusuke Yasuda | 2013-03-19 |
| 8183607 | Semiconductor device | Ryoichi Kajiwara, Masahiro Koizumi, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2012-05-22 |
| 8181268 | Scanning probe microscope and method of observing sample using the same | Toshihiko Nakata, Masahiro Watanabe, Takashi Inoue, Kishio Hidaka, Makoto Okai +1 more | 2012-05-15 |
| 8008772 | Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof | Yusuke Yasuda, Eiichi Ide | 2011-08-30 |
| 7985991 | MOSFET package | Ryoichi Kajiwara, Masahiro Koizumi, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2011-07-26 |
| 7955411 | Low temperature bonding material comprising metal particles and bonding method | Yusuke Yasuda, Eiichi Ide, Hiroshi Hozoji, Toshiaki Ishii | 2011-06-07 |
| 7589400 | Inverter and vehicle drive unit using the same | Hiroshi Hozoji, Satoru Shigeta, Tokihito Suwa | 2009-09-15 |
| 7579805 | Semiconductor device | Atsushi Saito, Katsuhiro Higuchi, Osamu Otsuka, Hidekazu Nishidai, Hiroshi Houzouji +2 more | 2009-08-25 |
| 7542317 | Semiconductor device and power conversion apparatus using the same | Katsunori Azuma, Hiroshi Hozoji, Kazuhiro Suzuki, Toshiya Satoh, Osamu Otsuka | 2009-06-02 |
| 7528485 | Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device | Hiroshi Hozoji, Kazuhiro Suzuki | 2009-05-05 |
| 7449786 | Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors | Naoki Kawanabe, Tomoo Matsuzawa, Takafumi Nishita | 2008-11-11 |
| 7400002 | MOSFET package | Ryoichi Kajiwara, Masahiro Koizumi, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2008-07-15 |