Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9736952 | Vehicle-mounted electronic module | Toshiaki Ishii, Masaru Kamoshida | 2017-08-15 |
| 9209044 | Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part | Shigehisa Motowaki, Yusuke Asaumi | 2015-12-08 |
| 9177833 | Semiconductor device and method of manufacturing the same | Takuya Nakajo, Masaki Tamura, Yasushi Takahashi, Keiichi Okawa, Sigehisa Motowaki +1 more | 2015-11-03 |
| 8975747 | Wiring material and semiconductor module using the same | Takashi Ando, Hiroshi Hozoji | 2015-03-10 |
| 8816411 | Mosfet package | Masahiro Koizumi, Toshiak Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2014-08-26 |
| 8643185 | Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material | Kazutoshi Itou, Hiroi Oka, Takuya Nakajo, Yuichi Yato | 2014-02-04 |
| 8629352 | Enameled insulated wire and manufacturing method thereof | Yoshiyuki Ando, Tomiya Abe, Shigehisa Motowaki | 2014-01-14 |
| 8492202 | Semiconductor device and method of manufacturing the same | Shigehisa Motowaki, Kazutoshi Ito, Toshiaki Ishii, Katsuo Arai, Takuya Nakajo +1 more | 2013-07-23 |
| 8455986 | Mosfet package | Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2013-06-04 |
| 8314484 | Semiconductor device and method of manufacturing the same | Shigehisa Motowaki, Kazutoshi Ito, Toshiaki Ishii, Katsuo Arai, Takuya Nakajo +1 more | 2012-11-20 |
| 8313983 | Fabrication method for resin-encapsulated semiconductor device | Shigehisa Motowaki, Kazutoshi Itou, Hiroshi Hozoji | 2012-11-20 |
| 8303854 | Sintering silver paste material and method for bonding semiconductor chip | Shigehisa Motowaki, Yusuke Asaumi | 2012-11-06 |
| 8183607 | Semiconductor device | Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2012-05-22 |
| 7985991 | MOSFET package | Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2011-07-26 |
| 7964975 | Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them | Shigehisa Motowaki, Kazutoshi Itou, Hiroshi Hozoji | 2011-06-21 |
| 7879455 | High-temperature solder, high-temperature solder paste and power semiconductor using same | Kazutoshi Itou | 2011-02-01 |
| 7816780 | Semiconductor apparatus and manufacturing method of semiconductor apparatus | Kazutoshi Ito | 2010-10-19 |
| 7608917 | Power semiconductor module | Kazuhiro Suzuki, Toshiaki Ishii, Kazutoshi Itou | 2009-10-27 |
| 7400002 | MOSFET package | Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2008-07-15 |
| 7394146 | MOSFET package | Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2008-07-01 |
| 7342267 | MOSFET package | Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2008-03-11 |
| 7332757 | MOSFET package | Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2008-02-19 |
| 6798072 | Flip chip assembly structure for semiconductor device and method of assembling therefor | Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Asao Nishimura, Masayoshi Shinoda | 2004-09-28 |
| 6784554 | Semiconductor device and manufacturing method thereof | Masahiro Koizumi, Masayoshi Shinoda, Akihiko Narisawa, Asao Nishimura, Toshiaki Morita +2 more | 2004-08-31 |
| 6774466 | Semiconductor device | Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2004-08-10 |