Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8492202 | Semiconductor device and method of manufacturing the same | Ryoichi Kajiwara, Shigehisa Motowaki, Kazutoshi Ito, Toshiaki Ishii, Takuya Nakajo +1 more | 2013-07-23 |
| 8314484 | Semiconductor device and method of manufacturing the same | Ryoichi Kajiwara, Shigehisa Motowaki, Kazutoshi Ito, Toshiaki Ishii, Takuya Nakajo +1 more | 2012-11-20 |
| 8114710 | Manufacturing method of resin-sealed semiconductor device | Akira Muto, Nobuya Koike, Atsushi Fujiki | 2012-02-14 |
| 7405469 | Semiconductor device and method of manufacturing the same | Hidemasa Kagii, Akira Muto, Ichio Shimizu, Hiroshi Sato, Hiroyuki Nakamura +4 more | 2008-07-29 |
| 7374965 | Manufacturing method of semiconductor device | Akira Muto, Ichio Shimizu, Hidemasa Kagii, Hiroshi Sato, Hiroyuki Nakamura +3 more | 2008-05-20 |
| 7220617 | Semiconductor device and method of manufacturing the same | Hidemasa Kagii, Akira Muto, Ichio Shimizu, Hiroshi Sato, Hiroyuki Nakamura +4 more | 2007-05-22 |
| 6838315 | Semiconductor device manufacturing method wherein electrode members are exposed from a mounting surface of a resin encapsulator | Tadatoshi Danno, Ichio Shimizu | 2005-01-04 |
| 6474987 | Wafer holder | Tetsuya Nakai, Makoto Shinohara, Fumitomo Kawahara, Makoto Saito, Yasuhiko Kawamura | 2002-11-05 |
| 5304512 | Process for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the process | Sumio Okada, Takashi Ooba, Kazuya Takahashi, Mayumi Kaneko | 1994-04-19 |
| 4698904 | Apparatus for assembling fins and tubes for heat exchangers | Yoshio Nozawa, Izumi Ochiai, Yukio Kitayama, Masahiro Miyagi, Katsuharu Uehara +3 more | 1987-10-13 |