Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9209044 | Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part | Ryoichi Kajiwara, Yusuke Asaumi | 2015-12-08 |
| 9136244 | Semiconductor package having a metal member and a resin mold, which are bonded to a silane coupling agent and an intermediate layer of an oxide film | Katsumi Mabuchi, Haruo Akahoshi | 2015-09-15 |
| 8629352 | Enameled insulated wire and manufacturing method thereof | Yoshiyuki Ando, Tomiya Abe, Ryoichi Kajiwara | 2014-01-14 |
| 8492202 | Semiconductor device and method of manufacturing the same | Ryoichi Kajiwara, Kazutoshi Ito, Toshiaki Ishii, Katsuo Arai, Takuya Nakajo +1 more | 2013-07-23 |
| 8314484 | Semiconductor device and method of manufacturing the same | Ryoichi Kajiwara, Kazutoshi Ito, Toshiaki Ishii, Katsuo Arai, Takuya Nakajo +1 more | 2012-11-20 |
| 8313983 | Fabrication method for resin-encapsulated semiconductor device | Ryoichi Kajiwara, Kazutoshi Itou, Hiroshi Hozoji | 2012-11-20 |
| 8303854 | Sintering silver paste material and method for bonding semiconductor chip | Ryoichi Kajiwara, Yusuke Asaumi | 2012-11-06 |
| 7964975 | Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them | Ryoichi Kajiwara, Kazutoshi Itou, Hiroshi Hozoji | 2011-06-21 |
| 7586755 | Electronic circuit component | Toshiya Satoh, Masahiko Ogino, Takao Miwa, Takashi Naitou, Takashi Namekawa +1 more | 2009-09-08 |
| 7535106 | Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate | Osamu Shiono, Takao Ishikawa, Takashi Namekawa, Yasutaka Suzuki, Takashi Naito +6 more | 2009-05-19 |
| 7520742 | Nanoprint equipment and method of making fine structure | Akihiro Miyauchi, Masahiko Ogino, Kosuke Kuwabara | 2009-04-21 |
| 7341441 | Nanoprint equipment and method of making fine structure | Masahiko Ogino, Akihiro Miyauchi, Kosuke Kuwabara | 2008-03-11 |
| 7183650 | Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate | Osamu Shiono, Takao Ishikawa, Takashi Namekawa, Yasutaka Suzuki, Takashi Naito +6 more | 2007-02-27 |
| 7047052 | Cellular phone terminal | Hiroshi Akai, Yoshinori Suzuki, Junji Nakata, Takeshi Hoshino, Toyota Honda | 2006-05-16 |
| 6840833 | Gas discharge type display panel and production method therefor | Tomohiko Murase, Michifumi Kawai, Ryohei Sato, Yasuhiro Matsuoka, Yoshihiro Kato +2 more | 2005-01-11 |
| 5764129 | Ceramic resistor, production method thereof, neutral grounding resistor and circuit breaker | Moritaka Syouji, Tadashi Kitami, Seiichi Yamada, Ken Takahashi, Shingo Shirakawa +2 more | 1998-06-09 |
| 5614138 | Method of fabricating non-linear resistor | Seiichi Yamada, Shigeru Tanaka, Moritaka Shoji, Ken Takahashi, Shingo Shirakawa +2 more | 1997-03-25 |
| 5610570 | Voltage non-linear resistor and fabricating method thereof | Seiich Yamada, Shigeru Tanaka, Moritaka Syouji, Ken Takahashi, Shingo Shirakawa +1 more | 1997-03-11 |