Issued Patents All Time
Showing 1–25 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12361536 | EUV mask inspection device, EUV mask inspection method, non-transitory computer-readable medium storing EUV mask inspection program, and EUV mask inspection system including a gray image based on design data of a pattern | Hirokazu Seki | 2025-07-15 |
| 12119277 | Method for producing package substrate for mounting semiconductor device | Syunsuke Hirano, Takaaki Ogashiwa | 2024-10-15 |
| 11990349 | Method for producing package substrate for loading semiconductor device | Syunsuke Hirano, Takaaki Ogashiwa | 2024-05-21 |
| 11915931 | Extreme ultraviolet lithography patterning method | Choong-Man Lee, Soo Doo Chae, Angelique Raley, Qiaowei Lou, Toshio Hasegawa | 2024-02-27 |
| 11877396 | Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing same | Syunsuke Hirano, Takaaki Ogashiwa | 2024-01-16 |
| 11822233 | Image pickup apparatus and focus adjustment method using bending correction to adjust focusing | Hiroki MIYAI, Yoshito Fujiwara | 2023-11-21 |
| 11664240 | Method for producing laminate having patterned metal foil, and laminate having patterned metal foil | Syunsuke Hirano, Takaaki Ogashiwa, Kazuaki KAWASHITA, Makoto Murakami | 2023-05-30 |
| 11217445 | Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device | Syunsuke Hirano, Takaaki Ogashiwa, Kazuaki KAWASHITA, Youichi Nakajima | 2022-01-04 |
| 11197379 | Method for producing printed wiring board | Kazuaki KAWASHITA, Takaaki Ogashiwa, Syunsuke Hirano | 2021-12-07 |
| 11081367 | Support and method for producing semiconductor device-mounting substrate using the same | Shunsuke Hirano, Takaaki Ogashiwa, Kazuaki KAWASHITA | 2021-08-03 |
| 10998681 | Electronic component to reduce noise caused by the tip end of a memory card | Kotaro Fujimori, Yuko Yoshida | 2021-05-04 |
| 10964552 | Methods for producing laminate and substrate for mounting a semiconductor device | Takaaki Ogashiwa, Yoichi Nakajima, Takaaki Ichikawa, Kazuaki KAWASHITA | 2021-03-30 |
| 10791626 | Prepreg, metal foil-clad laminate, and printed wiring board | Tomoki Hamajima, Meguru Ito, Eisuke Shiga | 2020-09-29 |
| 10727081 | Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrate | Syunsuke Hirano, Takaaki Ogashiwa, Kazuaki KAWASHITA, Youichi Nakajima | 2020-07-28 |
| 10518341 | Cutting method for fiber reinforced composite material | Yousuke Matsuyama, Shigeru Horie, Kenji Ishikura, Kazuhiro Nakamura | 2019-12-31 |
| 10407871 | Work machine | Yoichi NISHIGORI, Toshihiro Nakao | 2019-09-10 |
| 10212813 | Resin composition, prepreg, and laminated sheet | Takaaki Ogashiwa, Hiroshi Takahashi, Tetsuro Miyahira | 2019-02-19 |
| 10178767 | Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board | Tomo Chiba, Hiroshi Takahashi, Eisuke Shiga | 2019-01-08 |
| 9955573 | Resin composition, prepreg and laminate | Takaaki Ogashiwa, Hiroshi Takahashi, Tetsuro Miyahira | 2018-04-24 |
| 9944787 | Resin composition, prepreg and laminate | Chisato Saito, Daisuke Ueyama, Masanobu Sogame, Yoshinori Mabuchi | 2018-04-17 |
| 9902825 | Resin composition, prepreg, and laminated sheet | Takaaki Ogashiwa, Hiroshi Takahashi, Tetsuro Miyahira | 2018-02-27 |
| 9832870 | Resin composition, prepreg, metal foil-clad laminate and printed wiring board | Hiroaki Kobayashi, Masanobu Sogame, Kentaro Nomizu, Yoshinori Mabuchi | 2017-11-28 |
| 9829010 | Blower device | Kenji Yoshida, Takahiro Iwasaki, Nariaki Horinouchi | 2017-11-28 |
| 9775238 | Resin composition, and prepreg and laminate using the same | Daisuke Ueyama, Masanobu Sogame, Chisato Saito, Yoshinori Mabuchi | 2017-09-26 |
| 9706651 | Resin composition, prepreg, and laminate | Chisato Saito, Masanobu Sogame, Yoshinori Mabuchi | 2017-07-11 |