Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119277 | Method for producing package substrate for mounting semiconductor device | Yoshihiro Kato, Takaaki Ogashiwa | 2024-10-15 |
| 11990349 | Method for producing package substrate for loading semiconductor device | Yoshihiro Kato, Takaaki Ogashiwa | 2024-05-21 |
| 11877396 | Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing same | Yoshihiro Kato, Takaaki Ogashiwa | 2024-01-16 |
| 11664240 | Method for producing laminate having patterned metal foil, and laminate having patterned metal foil | Yoshihiro Kato, Takaaki Ogashiwa, Kazuaki KAWASHITA, Makoto Murakami | 2023-05-30 |
| 11217445 | Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device | Yoshihiro Kato, Takaaki Ogashiwa, Kazuaki KAWASHITA, Youichi Nakajima | 2022-01-04 |
| 11197379 | Method for producing printed wiring board | Kazuaki KAWASHITA, Takaaki Ogashiwa, Yoshihiro Kato | 2021-12-07 |
| 10727081 | Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrate | Yoshihiro Kato, Takaaki Ogashiwa, Kazuaki KAWASHITA, Youichi Nakajima | 2020-07-28 |