Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12134696 | Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board | Tetsuro Miyahira, Tatsuro TAKAMURA, Sayaka ITO | 2024-11-05 |
| 12119277 | Method for producing package substrate for mounting semiconductor device | Syunsuke Hirano, Yoshihiro Kato | 2024-10-15 |
| 11990349 | Method for producing package substrate for loading semiconductor device | Syunsuke Hirano, Yoshihiro Kato | 2024-05-21 |
| 11877396 | Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing same | Syunsuke Hirano, Yoshihiro Kato | 2024-01-16 |
| 11664240 | Method for producing laminate having patterned metal foil, and laminate having patterned metal foil | Syunsuke Hirano, Yoshihiro Kato, Kazuaki KAWASHITA, Makoto Murakami | 2023-05-30 |
| 11383307 | Entry sheet for drilling and method for drilling processing using same | Takayuki Kamei, Yousuke Matsuyama | 2022-07-12 |
| 11217445 | Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device | Syunsuke Hirano, Yoshihiro Kato, Kazuaki KAWASHITA, Youichi Nakajima | 2022-01-04 |
| 11197379 | Method for producing printed wiring board | Kazuaki KAWASHITA, Syunsuke Hirano, Yoshihiro Kato | 2021-12-07 |
| 11097357 | Drill bit and hole formation method | Yousuke Matsuyama, Noritsugu Umehara, Shintarou OYAMA | 2021-08-24 |
| 11081367 | Support and method for producing semiconductor device-mounting substrate using the same | Shunsuke Hirano, Yoshihiro Kato, Kazuaki KAWASHITA | 2021-08-03 |
| 10964552 | Methods for producing laminate and substrate for mounting a semiconductor device | Yoshihiro Kato, Yoichi Nakajima, Takaaki Ichikawa, Kazuaki KAWASHITA | 2021-03-30 |
| 10727081 | Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrate | Syunsuke Hirano, Yoshihiro Kato, Kazuaki KAWASHITA, Youichi Nakajima | 2020-07-28 |
| 10674609 | Entry sheet for drilling | Yousuke Matsuyama | 2020-06-02 |
| 10486324 | Entry sheet for drilling and method for drilling processing using same | Takayuki Kamei, Yousuke Matsuyama | 2019-11-26 |
| 10478991 | Entry sheet for drilling and method for drilling processing using same | Takayuki Kamei, Yousuke Matsuyama | 2019-11-19 |
| 10384322 | Lubricant material for assisting machining process and machining method | Yousuke Matsuyama | 2019-08-20 |
| 10212813 | Resin composition, prepreg, and laminated sheet | Hiroshi Takahashi, Tetsuro Miyahira, Yoshihiro Kato | 2019-02-19 |
| 10030141 | Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board | Tomo Chiba, Hiroshi Takahashi, Eisuke Shiga | 2018-07-24 |
| 9955573 | Resin composition, prepreg and laminate | Yoshihiro Kato, Hiroshi Takahashi, Tetsuro Miyahira | 2018-04-24 |
| 9902825 | Resin composition, prepreg, and laminated sheet | Yoshihiro Kato, Hiroshi Takahashi, Tetsuro Miyahira | 2018-02-27 |
| 9902851 | Resin composition, prepreg, laminate, and printed wiring board | Hiroshi Takahashi, Tomo Chiba, Nobuyoshi Ohnishi, Katsuya Tomizawa, Keisuke Takada +1 more | 2018-02-27 |
| 9905328 | Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same | Keiichi Hasebe, Naoki KASHIMA, Takenori Takiguchi | 2018-02-27 |
| 9480164 | Resin composition, prepreg, and laminate | Hiroshi Takahashi, Tetsuro Miyahira, Yoshihiro Kato | 2016-10-25 |
| 9232648 | Molybdenum compound powder, prepreg, and laminate | Tetsuro Miyahira, Yoshihiro Kato, Hiroshi Takahashi | 2016-01-05 |