Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10703874 | Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them | Yoichi Takano, Nobuyoshi Ohnishi, Katsuya Tomizawa, Hiroshi Takahashi, Eisuke Shiga | 2020-07-07 |
| 10550228 | Resin composition, prepreg, metal foil-clad laminate, and printed circuit board | Katsuya Tomizawa, Meguru Ito, Tomoki Hamajima, Eisuke Shiga, Kentaro Takano +1 more | 2020-02-04 |
| 9905328 | Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same | Keiichi Hasebe, Takenori Takiguchi, Takaaki Ogashiwa | 2018-02-27 |
| 9351397 | Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same | Keiichi Hasebe, Seiji Shika, Yoshinori Mabuchi | 2016-05-24 |