Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12312323 | Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | Shunsuke Katagiri, Takuya Suzuki, Yune Kumazawa | 2025-05-27 |
| 12133339 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | Yune Kumazawa, Takuya Suzuki | 2024-10-29 |
| 11767287 | Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | Shunsuke Katagiri, Takuya Suzuki, Yune Kumazawa | 2023-09-26 |
| 11680139 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | Yune Kumazawa, Takuya Suzuki, Shunsuke Katagiri | 2023-06-20 |
| 11643493 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | Yune Kumazawa, Takuya Suzuki, Shunsuke Katagiri | 2023-05-09 |
| 11466123 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | Yune Kumazawa, Takuya Suzuki, Shunsuke Katagiri | 2022-10-11 |
| 11447658 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | Shunsuke Katagiri, Takuya Suzuki, Yune Kumazawa | 2022-09-20 |
| 11370857 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | Yune Kumazawa, Takuya Suzuki | 2022-06-28 |
| 9351397 | Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same | Keiichi Hasebe, Naoki KASHIMA, Yoshinori Mabuchi | 2016-05-24 |
| 7192651 | Resin composition and prepreg for laminate and metal-clad laminate | Daisuke Ohno, Kenji Ishii, Yasumasa Norisue, Michio Nawata, Yoshinori Kondo +1 more | 2007-03-20 |