Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12195592 | Bisimide phenol compound | Tatsuya HIKICHI, Daiki WAKAHARA | 2025-01-14 |
| 10869390 | Resin composition, prepreg, metal foil-clad laminate, and printed circuit board | Yoichi Takano, Tomo Chiba, Meguru Ito, Eisuke Shiga | 2020-12-15 |
| 10721817 | Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them | Yoichi Takano, Hiroshi Takahashi, Eisuke Shiga | 2020-07-21 |
| 10703874 | Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them | Yoichi Takano, Katsuya Tomizawa, Naoki KASHIMA, Hiroshi Takahashi, Eisuke Shiga | 2020-07-07 |
| 9902851 | Resin composition, prepreg, laminate, and printed wiring board | Hiroshi Takahashi, Tomo Chiba, Katsuya Tomizawa, Keisuke Takada, Eisuke Shiga +1 more | 2018-02-27 |