Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769607 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | Yoichi Takano, Meguru Ito, Eisuke Shiga | 2023-09-26 |
| 11718708 | Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board | Mayumi Kikuchi, Hidetoshi Kawai | 2023-08-08 |
| 11702504 | Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | Shohei Yamaguchi, Norihiro Shida, Hidetoshi Kawai | 2023-07-18 |
| 11499005 | Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board | Mayumi Kikuchi, Hidetoshi Kawai | 2022-11-15 |
| 11195638 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | Yoichi Takano, Meguru Ito, Eisuke Shiga | 2021-12-07 |
| 10815349 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | Tomoki Hamajima, Shohei Yamaguchi, Eisuke Shiga, Meguru Ito | 2020-10-27 |
| 10717837 | Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same | Eisuke Shiga, Meguru Ito, Tomo Chiba | 2020-07-21 |
| 10703874 | Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them | Yoichi Takano, Nobuyoshi Ohnishi, Naoki KASHIMA, Hiroshi Takahashi, Eisuke Shiga | 2020-07-07 |
| 10676579 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | Yoichi Takano, Meguru Ito, Eisuke Shiga | 2020-06-09 |
| 10563029 | Resin composition and prepreg, resin sheet, laminate, and printed circuit board | Yoichi Takano, Takashi Kubo, Tomo Chiba, Eisuke Shiga | 2020-02-18 |
| 10550228 | Resin composition, prepreg, metal foil-clad laminate, and printed circuit board | Naoki KASHIMA, Meguru Ito, Tomoki Hamajima, Eisuke Shiga, Kentaro Takano +1 more | 2020-02-04 |
| 10292260 | Insulating layer for printed circuit board and printed circuit board | Tomo Chiba, Meguru Ito, Eisuke Shiga | 2019-05-14 |
| 10138393 | Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board | Tomo Chiba, Hiroshi Takahashi, Eisuke Shiga, Daisuke Ueyama, Kentaro Nomizu | 2018-11-27 |
| 9902851 | Resin composition, prepreg, laminate, and printed wiring board | Hiroshi Takahashi, Tomo Chiba, Nobuyoshi Ohnishi, Keisuke Takada, Eisuke Shiga +1 more | 2018-02-27 |