Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11390058 | Easily tearable aluminum-vapor-deposited biaxially oriented film | Takafumi Oda | 2022-07-19 |
| 10869390 | Resin composition, prepreg, metal foil-clad laminate, and printed circuit board | Nobuyoshi Ohnishi, Yoichi Takano, Meguru Ito, Eisuke Shiga | 2020-12-15 |
| 10717837 | Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same | Katsuya Tomizawa, Eisuke Shiga, Meguru Ito | 2020-07-21 |
| 10563029 | Resin composition and prepreg, resin sheet, laminate, and printed circuit board | Yoichi Takano, Katsuya Tomizawa, Takashi Kubo, Eisuke Shiga | 2020-02-18 |
| 10292260 | Insulating layer for printed circuit board and printed circuit board | Katsuya Tomizawa, Meguru Ito, Eisuke Shiga | 2019-05-14 |
| 10178767 | Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board | Hiroshi Takahashi, Eisuke Shiga, Yoshihiro Kato | 2019-01-08 |
| 10138393 | Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board | Katsuya Tomizawa, Hiroshi Takahashi, Eisuke Shiga, Daisuke Ueyama, Kentaro Nomizu | 2018-11-27 |
| 10030141 | Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board | Hiroshi Takahashi, Eisuke Shiga, Takaaki Ogashiwa | 2018-07-24 |
| 9902851 | Resin composition, prepreg, laminate, and printed wiring board | Hiroshi Takahashi, Nobuyoshi Ohnishi, Katsuya Tomizawa, Keisuke Takada, Eisuke Shiga +1 more | 2018-02-27 |