Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769607 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | Katsuya Tomizawa, Yoichi Takano, Eisuke Shiga | 2023-09-26 |
| 11195638 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | Katsuya Tomizawa, Yoichi Takano, Eisuke Shiga | 2021-12-07 |
| 10869390 | Resin composition, prepreg, metal foil-clad laminate, and printed circuit board | Nobuyoshi Ohnishi, Yoichi Takano, Tomo Chiba, Eisuke Shiga | 2020-12-15 |
| 10815349 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | Katsuya Tomizawa, Tomoki Hamajima, Shohei Yamaguchi, Eisuke Shiga | 2020-10-27 |
| 10791626 | Prepreg, metal foil-clad laminate, and printed wiring board | Tomoki Hamajima, Eisuke Shiga, Yoshihiro Kato | 2020-09-29 |
| 10717837 | Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same | Katsuya Tomizawa, Eisuke Shiga, Tomo Chiba | 2020-07-21 |
| 10676579 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | Katsuya Tomizawa, Yoichi Takano, Eisuke Shiga | 2020-06-09 |
| 10550228 | Resin composition, prepreg, metal foil-clad laminate, and printed circuit board | Naoki KASHIMA, Katsuya Tomizawa, Tomoki Hamajima, Eisuke Shiga, Kentaro Takano +1 more | 2020-02-04 |
| 10292260 | Insulating layer for printed circuit board and printed circuit board | Katsuya Tomizawa, Tomo Chiba, Eisuke Shiga | 2019-05-14 |
| 9904860 | Vehicle exterior environment recognition apparatus | Seisuke Kasaoki | 2018-02-27 |
| 9512329 | Resin composition, prepreg, and laminate | Takeshi Nobukuni, Yoshihiro Kato, Tomoki Hamajima | 2016-12-06 |