Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935803 | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device | Masashi Okaniwa, Kohei Higashiguchi, Tsuyoshi Kida | 2024-03-19 |
| 11924979 | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device | Masashi Okaniwa, Kohei Higashiguchi, Tsuyoshi Kida | 2024-03-05 |
| 11053382 | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | Kohei Higashiguchi, Tsuyoshi Kida | 2021-07-06 |
| 10808103 | Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layer | Kohei Higashiguchi, Tsuyoshi Kida | 2020-10-20 |
| 9905328 | Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same | Keiichi Hasebe, Naoki KASHIMA, Takaaki Ogashiwa | 2018-02-27 |