Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664240 | Method for producing laminate having patterned metal foil, and laminate having patterned metal foil | Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa, Makoto Murakami | 2023-05-30 |
| 11217445 | Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device | Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa, Youichi Nakajima | 2022-01-04 |
| 11197379 | Method for producing printed wiring board | Takaaki Ogashiwa, Syunsuke Hirano, Yoshihiro Kato | 2021-12-07 |
| 11081367 | Support and method for producing semiconductor device-mounting substrate using the same | Shunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa | 2021-08-03 |
| 10964552 | Methods for producing laminate and substrate for mounting a semiconductor device | Yoshihiro Kato, Takaaki Ogashiwa, Yoichi Nakajima, Takaaki Ichikawa | 2021-03-30 |
| 10727081 | Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrate | Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa, Youichi Nakajima | 2020-07-28 |