Issued Patents All Time
Showing 1–25 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139748 | Power module, power converter device, and electrically powered vehicle | Kinya Nakatsu, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama +1 more | 2021-10-05 |
| 10580561 | Transformer and power converter | — | 2020-03-03 |
| 10559509 | Insulating substrate and semiconductor device using same | Kenji Hayashi, Hiroyuki Itoh, Hisayuki Imamura, Hiroyuki Nagatomo | 2020-02-11 |
| 10348214 | Power module, power converter device, and electrically powered vehicle | Kinya Nakatsu, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama +1 more | 2019-07-09 |
| 9729076 | Power module, power converter device, and electrically powered vehicle | Kinya Nakatsu, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama +1 more | 2017-08-08 |
| 9407163 | Power module, power converter device, and electrically powered vehicle | Kinya Nakatsu, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama +1 more | 2016-08-02 |
| 9373558 | Resin-sealed electronic control device | Nobutake Tsuyuno, Takashi Naito, Motomune Kodama, Masanori Miyagi, Takuya Aoyagi | 2016-06-21 |
| 8975747 | Wiring material and semiconductor module using the same | Takashi Ando, Ryoichi Kajiwara | 2015-03-10 |
| 8946567 | Power module, power converter device, and electrically powered vehicle | Kinya Nakatsu, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama +1 more | 2015-02-03 |
| 8847374 | Power semiconductor module and manufacturing method thereof | Eiichi Ide, Shinji Hiramitsu, Nobutake Tsuyuno, Kinya Nakatsu, Takeshi Tokuyama +2 more | 2014-09-30 |
| 8821768 | Bonding method and bonding material using metal particle | Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Toshiaki Ishii | 2014-09-02 |
| 8821676 | Low temperature bonding material comprising coated metal nanoparticles, and bonding method | Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Toshiaki Ishii | 2014-09-02 |
| 8723306 | Power semiconductor unit, power module, power semiconductor unit manufacturing method, and power module manufacturing method | Nobutake Tsuyuno, Toshiaki Ishii, Tokihito Suwa, Kinya Nakatsu, Takeshi Tokuyama +1 more | 2014-05-13 |
| 8472188 | Semiconductor power module, inverter, and method of manufacturing a power module | Keisuke Horiuchi, Atsuo Nishihara, Michiaki Hiyoshi, Takehide Yokozuka | 2013-06-25 |
| 8313983 | Fabrication method for resin-encapsulated semiconductor device | Ryoichi Kajiwara, Shigehisa Motowaki, Kazutoshi Itou | 2012-11-20 |
| 8050037 | Electronic control device using LC module structure | Nobutake Tsuyuno, Hideto Yoshinari, Masahiko Asano, Masahide Harada, Shinya Kawakita | 2011-11-01 |
| 7964975 | Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them | Ryoichi Kajiwara, Shigehisa Motowaki, Kazutoshi Itou | 2011-06-21 |
| 7955411 | Low temperature bonding material comprising metal particles and bonding method | Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Toshiaki Ishii | 2011-06-07 |
| 7816786 | Semiconductor unit, and power conversion system and on-vehicle electrical system using the same | Kinya Nakatsu, Hideki Miyazaki, Yoshitaka Takezawa, Toshiaki Ishii | 2010-10-19 |
| 7589400 | Inverter and vehicle drive unit using the same | Toshiaki Morita, Satoru Shigeta, Tokihito Suwa | 2009-09-15 |
| 7542317 | Semiconductor device and power conversion apparatus using the same | Katsunori Azuma, Toshiaki Morita, Kazuhiro Suzuki, Toshiya Satoh, Osamu Otsuka | 2009-06-02 |
| 7528485 | Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device | Toshiaki Morita, Kazuhiro Suzuki | 2009-05-05 |
| 7504720 | Semiconductor unit, and power conversion system and on-vehicle electrical system using the same | Kinya Nakatsu, Hideki Miyazaki, Yoshitaka Takezawa, Toshiaki Ishii | 2009-03-17 |
| 7425762 | Electronic apparatus | Takehiko Hasebe, Takehide Yokozuka, Nobuyuki Ushifusa, Masahide Harada, Eiji Matsuzaki | 2008-09-16 |
| 7393771 | Method for mounting an electronic part on a substrate using a liquid containing metal particles | Toshiaki Morita, Hiroshi Sasaki | 2008-07-01 |