Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6569764 | Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material | Toshinori Hirashima, Yasushi Takahashi, Masahiro Koizumi, Munehisa Kishimoto | 2003-05-27 |
| 5884835 | Ultrasonic bonding method and ultrasonic bonding apparatus | Toshiyuki Takahashi, Kazuya Takahashi, Masahiro Koizumi, Hiroshi Watanabe, Yukiharu Akiyama | 1999-03-23 |
| 5431324 | Ultrasonic bonding apparatus and quality monitoring method | Mituo Katou, Kazuya Takahashi, Minoru Maruta, Tokiyuki Seto, Kunihiro Tsubosaki | 1995-07-11 |
| 5323952 | Bonding apparatus and testing apparatus of a bonded portion | Mituo Kato, Kazuya Takahashi, Setuo Sekine, Tokiyuki Seto | 1994-06-28 |
| 4996589 | Semiconductor module and cooling device of the same | Takao Funamoto, Mituo Kato, Hiroshi Wachi, Tomohiko Shida | 1991-02-26 |
| 4809058 | Integrated circuit device | Takao Funamoto, Mituo Katou, Takeshi Matsuzaka, Tomohiko Shida, Hiroshi Wachi +5 more | 1989-02-28 |
| 4740866 | Sealed-type liquid cooling device with expandable bellow for semiconductor chips | Takao Funamoto, Mitsuo Katoo, Tomohiko Shida, Takeshi Matsuzaka, Hiroshi Wachi +1 more | 1988-04-26 |
| 4454408 | Method for controlling arc welding and apparatus therefor | Satoshi Kokura, Yuzo Kozono, Akira Onuma | 1984-06-12 |