Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5323952 | Bonding apparatus and testing apparatus of a bonded portion | Ryoichi Kajiwara, Kazuya Takahashi, Setuo Sekine, Tokiyuki Seto | 1994-06-28 |
| 4996589 | Semiconductor module and cooling device of the same | Ryoichi Kajiwara, Takao Funamoto, Hiroshi Wachi, Tomohiko Shida | 1991-02-26 |
| 4464499 | Wax for low gloss resin exterior parts of an automobile | Yoshiro Umemoto, Tsugumi Sanmiya | 1984-08-07 |