Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4740866 | Sealed-type liquid cooling device with expandable bellow for semiconductor chips | Ryoichi Kajiwara, Takao Funamoto, Tomohiko Shida, Takeshi Matsuzaka, Hiroshi Wachi +1 more | 1988-04-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4740866 | Sealed-type liquid cooling device with expandable bellow for semiconductor chips | Ryoichi Kajiwara, Takao Funamoto, Tomohiko Shida, Takeshi Matsuzaka, Hiroshi Wachi +1 more | 1988-04-26 |