Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5431324 | Ultrasonic bonding apparatus and quality monitoring method | Ryoichi Kajiwara, Kazuya Takahashi, Minoru Maruta, Tokiyuki Seto, Kunihiro Tsubosaki | 1995-07-11 |
| 4809058 | Integrated circuit device | Takao Funamoto, Ryoichi Kajiwara, Takeshi Matsuzaka, Tomohiko Shida, Hiroshi Wachi +5 more | 1989-02-28 |