Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 5431324 | Ultrasonic bonding apparatus and quality monitoring method | Ryoichi Kajiwara, Kazuya Takahashi, Minoru Maruta, Tokiyuki Seto, Kunihiro Tsubosaki | 1995-07-11 | $50,000 |
| 4809058 | Integrated circuit device | Takao Funamoto, Ryoichi Kajiwara, Takeshi Matsuzaka, Tomohiko Shida, Hiroshi Wachi +5 more | 1989-02-28 | $24,000 |