Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7449786 | Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors | Naoki Kawanabe, Toshiaki Morita, Takafumi Nishita | 2008-11-11 |
| 7199469 | Semiconductor device having stacked semiconductor chips sealed with a resin seal member | Toru Ishida, Tetsuharu Urawa, Fujio Ito, Kazunari Suzuki, Akihiko Kameoka +2 more | 2007-04-03 |
| 7049214 | Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors | Naoki Kawanabe, Toshiaki Morita, Takafumi Nishita | 2006-05-23 |
| 7015127 | Semiconductor device and a method of manufacturing the same | Yasuyuki Nakajima, Toshiaki Morita, Seiichi Tomoi, Naoki Kawanabe | 2006-03-21 |
| 7005310 | Manufacturing method of solid-state image sensing device | Kenji Hanada, Masaki Nakanishi, Koji Shida, Kazutoshi Takashima | 2006-02-28 |
| 6900551 | Semiconductor device with alternate bonding wire arrangement | Takafumi Nishita, Yasuyuki Nakajima, Toshiaki Morita | 2005-05-31 |
| 6897570 | Semiconductor device and method of manufacturing same | Takashi Nakajima, Naotaka Tanaka, Yasuyuki Nakajima, Ryo Haruta, Masashi Sahara +1 more | 2005-05-24 |
| 5252854 | Semiconductor device having stacked lead structure | Junichi Arita, Akihiko Iwaya, Masahiro Ichitani | 1993-10-12 |