Issued Patents All Time
Showing 1–25 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7615872 | Semiconductor device | Noriyuki Takahashi | 2009-11-10 |
| 7479705 | Semiconductor device | Noriyuki Takahashi | 2009-01-20 |
| 7286386 | Semiconductor device | Takashi Miwa, Yasumi Tsutsumi, Takanori Hashizume, Masamichi Sato, Naozumi Morino +3 more | 2007-10-23 |
| 7061785 | Stacked large-scale integrated circuit (LSI) semiconductor device with miniaturization and thinning of package | Takashi Miwa, Yasumi Tsutsumi, Takanori Hashizume, Masamichi Sato, Naozumi Morino +3 more | 2006-06-13 |
| 7015069 | Method of manufacturing a semiconductor device and a semiconductor device | Noriyuki Takahashi, Masayuki Suzuki, Kouji Tsuchiya, Takao Matsuura, Takanori Hashizume +4 more | 2006-03-21 |
| 6919622 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2005-07-19 |
| 6887739 | Method of manufacturing semiconductor package including forming a resin sealing member | Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta | 2005-05-03 |
| 6872597 | Method of manufacturing a semiconductor device and a semiconductor device | Noriyuki Takahashi, Masayuki Suzuki, Kouji Tsuchiya, Takao Matsuura, Takanori Hashizume +4 more | 2005-03-29 |
| 6764878 | Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate | Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta | 2004-07-20 |
| 6759279 | Method of manufacturing semiconductor device having resin sealing body | Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta | 2004-07-06 |
| 6723583 | Method of manufacturing a semiconductor device using a mold | Noriyuki Takahashi, Masayuki Suzuki, Kouji Tsuchiya, Takao Matsuura, Takanori Hashizume +4 more | 2004-04-20 |
| 6720208 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2004-04-13 |
| 6621160 | Semiconductor device and mounting board | Masanori Shibamoto, Ryo Haruta, Katsuyuki Matsumoto, Junichi Arita, Ichiro Anjo | 2003-09-16 |
| 6596561 | Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture | Noriyuki Takahashi, Masayuki Suzuki, Kouji Tsuchiya, Takao Matsuura, Takanori Hashizume +4 more | 2003-07-22 |
| 6590275 | Ball grid array type semiconductor package having a flexible substrate | Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta | 2003-07-08 |
| 6563212 | Semiconductor device | Masanori Shibamoto, Ryo Haruta, Katsuyuki Matsumoto, Junichi Arita, Ichiro Anjo | 2003-05-13 |
| 6531760 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2003-03-11 |
| 6512176 | Semiconductor device | Akihiro Yaguchi, Ryo Haruta | 2003-01-28 |
| 6476466 | Ball grid array type semiconductor package having a flexible substrate | Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta | 2002-11-05 |
| 6448111 | Method of manufacturing a semiconductor device | Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta | 2002-09-10 |
| 6437428 | Ball grid array type semiconductor package having a flexible substrate | Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta | 2002-08-20 |
| 6404049 | Semiconductor device, manufacturing method thereof and mounting board | Masanori Shibamoto, Ryo Haruta, Katsuyuki Matsumoto, Junichi Arita, Ichiro Anjo | 2002-06-11 |
| 6340793 | Semiconductor device | Akihiro Yaguchi, Ryo Haruta | 2002-01-22 |
| 6326681 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2001-12-04 |
| 6303982 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2001-10-16 |