Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11674083 | Thermoplastic liquid crystal polymer and film of same | Tatsuya Sunamoto, Michiyuki Nanba, Tetsuya Hara | 2023-06-13 |
| 11429646 | Non-transitory computer-readable storage medium storing information presentation program, information presentation device, and information presentation method of controlling to display information regarding trouble shooting | Ichiro Kotani, Makoto Adachi, Takashi Maeda, Kazuki Yamada | 2022-08-30 |
| 9538646 | Thermoplastic liquid crystal polymer film, and laminate and circuit board using same | Minoru Onodera, Tatsuya Sunamoto, Shuji Matsunaga | 2017-01-03 |
| 8466540 | Semiconductor device and manufacturing method therefor | Shigeki Tanaka, Masakazu Sakano, Toshiyuki Shinya, Kazuaki Yoshida, Takashi Sato +1 more | 2013-06-18 |
| 6909179 | Lead frame and semiconductor device using the lead frame and method of manufacturing the same | Shigeki Tanaka, Atsushi Fujisawa, Souichi Nagano, Tsugihiko Hirano, Ryouichi Oota +2 more | 2005-06-21 |
| 6887739 | Method of manufacturing semiconductor package including forming a resin sealing member | Atsushi Fujisawa, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2005-05-03 |
| 6803258 | Semiconductor device | Fujio Ito, Hiroaki Tanaka, Hiromichi Suzuki, Tokuji Toida, Kunihiro Tsubosaki +3 more | 2004-10-12 |
| 6764878 | Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate | Atsushi Fujisawa, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2004-07-20 |
| 6759279 | Method of manufacturing semiconductor device having resin sealing body | Atsushi Fujisawa, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2004-07-06 |
| 6673655 | Method of making semiconductor device having improved heat radiation plate arrangement | Fujio Ito, Hiroaki Tanaka, Hiromichi Suzuki, Tokuji Toida, Kunihiro Tsubosaki +3 more | 2004-01-06 |
| 6590275 | Ball grid array type semiconductor package having a flexible substrate | Atsushi Fujisawa, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2003-07-08 |
| 6551862 | Semiconductor device and method of manufacturing the same | Riyouichi Oota, Tsugihiko Hirano, Atsushi Fujisawa | 2003-04-22 |
| 6476466 | Ball grid array type semiconductor package having a flexible substrate | Atsushi Fujisawa, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2002-11-05 |
| 6448111 | Method of manufacturing a semiconductor device | Atsushi Fujisawa, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2002-09-10 |
| 6437428 | Ball grid array type semiconductor package having a flexible substrate | Atsushi Fujisawa, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2002-08-20 |
| 6396142 | Semiconductor device | Fujio Ito, Hiroaki Tanaka, Hiromichi Suzuki, Tokuji Toida, Kunihiro Tsubosaki +3 more | 2002-05-28 |
| 6265762 | Lead frame and semiconductor device using the lead frame and method of manufacturing the same | Shigeki Tanaka, Atsushi Fujisawa, Souichi Nagano, Tsugihiko Hirano, Ryouichi Oota +2 more | 2001-07-24 |
| 6232650 | Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting | Atsushi Fujisawa, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2001-05-15 |