Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6887739 | Method of manufacturing semiconductor package including forming a resin sealing member | Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani | 2005-05-03 |
| 6764878 | Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate | Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani | 2004-07-20 |
| 6759279 | Method of manufacturing semiconductor device having resin sealing body | Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani | 2004-07-06 |
| 6590275 | Ball grid array type semiconductor package having a flexible substrate | Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani | 2003-07-08 |
| 6476466 | Ball grid array type semiconductor package having a flexible substrate | Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani | 2002-11-05 |
| 6448111 | Method of manufacturing a semiconductor device | Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani | 2002-09-10 |
| 6437428 | Ball grid array type semiconductor package having a flexible substrate | Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani | 2002-08-20 |
| 6232650 | Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting | Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani | 2001-05-15 |