Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9324644 | Semiconductor device | — | 2016-04-26 |
| 9263274 | Method for manufacturing semiconductor device | Hiroshi Fujii | 2016-02-16 |
| 9184142 | Semiconductor device and manufacturing method of the same | — | 2015-11-10 |
| 9087850 | Method for manufacturing semiconductor device | Hiroshi Fujii | 2015-07-21 |
| 9006871 | Semiconductor device and method of manufacturing the same | — | 2015-04-14 |
| 8609468 | Semiconductor device and method of manufacturing the same | — | 2013-12-17 |
| 8466540 | Semiconductor device and manufacturing method therefor | Shigeki Tanaka, Masakazu Sakano, Toshiyuki Shinya, Takafumi Konno, Kazuaki Yoshida +1 more | 2013-06-18 |
| 8399302 | Method of manufacturing semiconductor device | Shigeki Tanaka, Masahiro Tani, Satoru Suzuki | 2013-03-19 |
| 8193024 | Manufacturing method for semiconductor devices and semiconductor device | — | 2012-06-05 |
| 8129621 | Wire harness fixing tool | Tatsuhiko Mizutani, Toshiya Sugiyama, Hiroshi Kato, Hideki Hattori, Tsutomu Sakata | 2012-03-06 |
| 7579674 | Semiconductor package configuration with improved lead portion arrangement | Kenji Amano, Hajime Hasebe | 2009-08-25 |
| 7348659 | Semiconductor device and method of manufacturing thereof | Kenji Amano, Hajime Hasebe | 2008-03-25 |
| 6924548 | Semiconductor device and its manufacturing method with leads that have an inverted trapezoid-like section | Hajime Hasebe, Makoto Aida, Motoya Ishida, Yasuhiro Kashimura, Yoichi Kinouchi | 2005-08-02 |
| 6909179 | Lead frame and semiconductor device using the lead frame and method of manufacturing the same | Shigeki Tanaka, Souichi Nagano, Tsugihiko Hirano, Ryouichi Oota, Takafumi Konno +2 more | 2005-06-21 |
| 6887739 | Method of manufacturing semiconductor package including forming a resin sealing member | Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2005-05-03 |
| 6764878 | Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate | Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2004-07-20 |
| 6759279 | Method of manufacturing semiconductor device having resin sealing body | Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2004-07-06 |
| 6664521 | Line switch part snow melting device | Shinji Kondo, Youji Uetani, Yoshiki Hama, Jun Iguchi, Harumi Tasaki +1 more | 2003-12-16 |
| 6590275 | Ball grid array type semiconductor package having a flexible substrate | Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2003-07-08 |
| 6551862 | Semiconductor device and method of manufacturing the same | Riyouichi Oota, Tsugihiko Hirano, Takafumi Konno | 2003-04-22 |
| 6476466 | Ball grid array type semiconductor package having a flexible substrate | Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2002-11-05 |
| 6448111 | Method of manufacturing a semiconductor device | Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2002-09-10 |
| 6437428 | Ball grid array type semiconductor package having a flexible substrate | Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2002-08-20 |
| 6265762 | Lead frame and semiconductor device using the lead frame and method of manufacturing the same | Shigeki Tanaka, Souichi Nagano, Tsugihiko Hirano, Ryouichi Oota, Takafumi Konno +2 more | 2001-07-24 |
| 6232650 | Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting | Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2001-05-15 |