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Method of manufacturing semiconductor device |
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Semiconductor device and method of manufacturing same |
Kazuko Hanawa, Makoto Nishimura |
2013-07-23 |
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Semiconductor device and method of manufacturing same |
Kazuko Hanawa, Makoto Nishimura |
2012-05-29 |
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Charged particle measuring device and measuring method thereof |
Nobuyoshi Kogawa, Hiroshi Kitaguchi, Tetsuya Matsui, Akihisa Kaihara |
2004-08-10 |
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Semiconductor device |
Kenji Ujiie, Kenichi Yamamoto |
2003-12-09 |
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Charged particle measuring device and measuring method thereof |
Nobuyoshi Kogawa, Hiroshi Kitaguchi, Tetsuya Matsui, Akihisa Kaihara |
2003-10-28 |
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Semiconductor device and mounting board |
Masanori Shibamoto, Masahiro Ichitani, Ryo Haruta, Katsuyuki Matsumoto, Ichiro Anjo |
2003-09-16 |
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Semiconductor device |
Masanori Shibamoto, Masahiro Ichitani, Ryo Haruta, Katsuyuki Matsumoto, Ichiro Anjo |
2003-05-13 |
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Semiconductor device, manufacturing method thereof and mounting board |
Masanori Shibamoto, Masahiro Ichitani, Ryo Haruta, Katsuyuki Matsumoto, Ichiro Anjo |
2002-06-11 |
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TSOP type semiconductor device |
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2001-05-15 |
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Semiconductor device with lead structure on principal surface of chip |
Kunihiro Tsubosaki, Michio Tanimoto, Kunihiko Nishi, Masahiro Ichitani, Shunji Koike +7 more |
1999-02-09 |
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Semiconductor device |
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1998-02-03 |
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Semiconductor device with lead structure within the planar area of the device |
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Semiconductor leadframe and its production method and plastic encapsulated semiconductor device |
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1996-11-05 |
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Packaged semiconductor device having stress absorbing film |
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Semiconductor leadframe and its production method and plastic encapsulated semiconductor device |
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1995-08-01 |
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Packaged semiconductor device having stress absorbing film |
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Method of uniformly encapsulating a semiconductor device in resin |
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1994-12-06 |
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Plastic sealed type semiconductor apparatus |
Akihiro Yaguchi, Asao Nishimura, Makoto Kitano, Ichiro Anjoh |
1994-03-29 |
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Semiconductor device having stacked lead structure |
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1993-10-12 |