Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5563443 | Packaged semiconductor device utilizing leadframe attached on a semiconductor chip | Teo B. Ching | 1996-10-08 |
| 5466888 | Packaged semiconductor device having stress absorbing film | Chai T. Chong, Masazumi Amagai, Ichiro Anjoh, Junichi Arita, Kunihiro Tsubosaki +2 more | 1995-11-14 |
| 5406028 | Packaged semiconductor device having stress absorbing film | Chai T. Chong, Masazumi Amagai, Ichiro Anjoh, Junichi Arita, Kunihiro Tsubosaki +2 more | 1995-04-11 |