Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11912071 | Tire | — | 2024-02-27 |
| 8095348 | Support system, support method and support program of resin molded article | Tsutomu Kono | 2012-01-10 |
| 7277771 | Three-dimensional foam analysis method, product design aiding method using the analysis method, and recording medium recording these methods | Tsutomu Kono | 2007-10-02 |
| 7096083 | Design support apparatus and method for supporting design of resin mold product | Osami Kaneto, Toshiya Teramae | 2006-08-22 |
| 7023027 | Diode package having an anode and a cathode formed on one surface of a diode chip | Toshiya Teramae, Yasuharu Ichinose, Shuichi Suzuki | 2006-04-04 |
| 6919622 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 2005-07-19 |
| 6861294 | Semiconductor devices and methods of making the devices | Shigeharu Tsunoda, Isamu Yoshida, Kazuya Ooji, Michiharu Honda, Makoto Kitano +5 more | 2005-03-01 |
| 6844219 | Semiconductor device and lead frame therefor | Makoto Kitano, Akihiro Yaguchi, Naotaka Tanaka, Takeshi Terasaki, Ichiro Anjoh +2 more | 2005-01-18 |
| 6720208 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 2004-04-13 |
| 6686226 | Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame | Shigeharu Tsunoda, Isamu Yoshida, Kazuya Ooji, Michiharu Honda, Makoto Kitano +5 more | 2004-02-03 |
| 6531760 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 2003-03-11 |
| 6465876 | Semiconductor device and lead frame therefor | Makoto Kitano, Akihiro Yaguchi, Naotaka Tanaka, Takeshi Terasaki, Ichiro Anjoh +2 more | 2002-10-15 |
| 6326681 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 2001-12-04 |
| 6303982 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 2001-10-16 |
| 6291880 | Semiconductor device including an integrally molded lead frame | Toshio Ogawa, Masaaki Takahashi, Masahiro Gouda, Noritaka Kamimura, Kazuhiro Suzuki +3 more | 2001-09-18 |
| 6204552 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 2001-03-20 |
| 6130114 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more | 2000-10-10 |
| 6124629 | Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 2000-09-26 |
| 6114192 | Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame | Shigeharu Tsunoda, Isamu Yoshida, Kazuya Ooji, Michiharu Honda, Makoto Kitano +5 more | 2000-09-05 |
| 6100115 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 2000-08-08 |
| 6100580 | Semiconductor device having all outer leads extending from one side of a resin member | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 2000-08-08 |
| 6081023 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more | 2000-06-27 |
| 6072231 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more | 2000-06-06 |
| 6069029 | Semiconductor device chip on lead and lead on chip manufacturing | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 2000-05-30 |
| 6018191 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more | 2000-01-25 |